Per-die defect history. Process window visible.
Every defect event logged with die X/Y coordinates, wafer ID, lot, recipe, and shift. Accumulated history surfaces systematic process excursions invisible in lot-level statistics.
| Date | Lot | Class | Conf. |
|---|---|---|---|
| 2026-03-14 | L-2241 | PASS | — |
| 2026-03-22 | L-2267 | Particle | 0.89 |
| 2026-04-01 | L-2301 | PASS | — |
| 2026-04-09 | L-2318 | Particle | 0.93 |
| 2026-04-18 | L-2344 | Particle | 0.91 |
Pattern detected: recurring particle at X13/Y08 — tool T47 focus point suspect
What die-level history enables
Spatial Pattern Detection
Cluster analysis identifies recurring defect patterns at specific die coordinates. Systematic tool contamination or focus drift shows up as a spatial signature across lots.
Lot Disposition Support
Defect maps available at lot completion for hold/release decisions. Configurable thresholds trigger automatic GEM alarm events when lot-level defect density exceeds recipe limits.
Process Window Data
Die-level yield data accumulates across lots, recipes, and tool configurations. Exportable to standard SPC and yield analysis platforms via CSV and standard fab database schemas.
Build die-level yield history at your facility
Start accumulating per-die defect data from day one of evaluation. Export to your existing yield analysis infrastructure.