Full-wafer surface inspection. Every die. Every shift.
Computer vision defect detection across the complete 300mm die map. Particle, scratch, crystal defect, and edge chip classification at 120 wafers/hour with third-shift parity guarantee.
Every die, every layer, every shift
Human visual inspection at 100% die coverage is economically impractical at 120 wafers/hour. Statistical sampling misses localized process excursions — a scratch defect cluster covering 20 die in one quadrant will be statistically invisible in a 5% random sample.
Lenspathio captures and classifies every die on every wafer. Defect density maps are generated at lot completion and available via SECS/GEM S6F11 push or local dashboard.
View Defect Classification DetailDetection performance doesn't degrade overnight
Human inspection degrades measurably on overnight shifts — fatigue reduces detection sensitivity and increases missed defects by 40–70% versus first-shift baseline in controlled studies. Lenspathio maintains consistent sensitivity regardless of shift.
First Shift (Human)
Baseline performance under optimal conditions. Engineers alert, lighting consistent.
Third Shift (Human)
117% degradation from first-shift baseline. Fatigue, shift handoff, reduced ambient alertness.
Any Shift (Lenspathio)
Consistent across all three shifts. Detection sensitivity identical at 3am and 9am.
Evaluate full-wafer inspection on your process
We run evaluations on customer-provided wafer sets with your process recipes. Blind classification compared against your gold standard defect map.