Evaluation Program
Send us your lot. We run the inspection.
Evaluations run against your actual production wafers — 200mm or 300mm, silicon or compound semiconductor. We accept raw lots or existing KLARF files from prior inspection runs. You receive a full wafer map, per-die classification breakdown, false positive count, and confidence score distribution for your specific process node. No demo data, no sandbox environment.
What to expect
1
Setup call (30 min)
We establish the scope: process node, wafer diameter, defect categories of interest, and whether you're providing raw wafer lots or existing KLARF files. We confirm the optical calibration parameters and scan mode appropriate for your process step.
2
Wafer data intake
You provide a 25–50 wafer lot (or KLARF files from prior inspection). We configure the classifier for your process node, run inspection, and generate a die-level wafer map with defect classification and confidence scores for each die.
3
Results review (within 2 weeks)
Deliverables: full wafer map in KLARF format, per-die taxonomy breakdown, false positive rate at your process conditions, and a comparison against your stated baseline FPR if available. We walk through the results on a follow-up call.
4
Integration trial (optional)
Optional: live SECS/GEM integration into your test MES environment. We handle E40/E87 process job configuration, KLARF coordinate validation against your SEM stage reference, and provide the IQ/OQ/PQ template documentation package for your qualification record.