The Platform

Three systems. One inspection line.

Lenspathio integrates defect classification, line-speed throughput management, and SECS/GEM fab communication into a single system that installs alongside your existing metrology tools.

23
Defect Types Classified
120
Wafers / Hour
<8ms
Per-die Inference
Native
SECS/GEM Support
System Architecture

What runs at inspection time

Each subsystem handles one layer of the inspection problem. Together they form a complete inline inspection solution.

01

Defect Detection Engine

CNN-based classification trained on semiconductor defect libraries covering scratches, particles, crystal defects, edge chips, and pattern deformations. The model receives per-die frame captures from your optical sensor hardware and outputs defect class, location (die X/Y coordinate), and confidence score. 23 classification categories — custom defect types can be added through supervised retraining with customer-provided labeled samples.

Defect Detection Details
Abstract visualization of semiconductor wafer defect detection analysis showing die-level inspection mapping
02

Throughput Management Pipeline

Parallel inference handles incoming frames from multiple inspection heads simultaneously. The pipeline queues, batches, and distributes inference jobs to prevent optical sensor wait states. Tested at 120 wafers/hour with zero inspection bottleneck at standard 300mm fab conditions. Throughput scales with hardware — a three-GPU configuration supports up to 160 wafers/hour.

Throughput Architecture
Abstract visualization of high-speed wafer inspection pipeline processing at production line speed
03

SECS/GEM Communication Layer

Native SECS-II host driver with GEM E30 compliance. Pushes defect maps, die-level yield data, and lot records directly to the fab MES using standard S6F11 event messages. No translation middleware required — qualification against your ATC test suite typically completes in 2–3 days. HSMS over Ethernet supported in addition to SECS-II RS-232 for older equipment stacks.

Integration Guide
Abstract visualization of semiconductor fab equipment communication network integration
Deployment

Installs in your existing inspection bay

No separate cleanroom enclosure required. The inspection module mounts inline with standard wafer handling equipment. All processing is on-premises — no cloud dependency, no outbound data.

On-Premises Processing

All ML inference runs locally on your industrial compute unit. No network dependency for inspection — your line stays up regardless of connectivity.

SEMI-Compliant Hardware

Industrial-grade compute unit meets SEMI S2 environmental safety standards. Rated for cleanroom class ISO 5 and above.

Recipe Version Control

Per-process-node, per-layer, per-tool recipe sets stored with version history. Roll back or A/B test threshold configurations without engineering intervention.

Run a platform evaluation at your facility

We ship an evaluation unit pre-configured for your stated process node. Bring-up typically takes 3–5 days with your integration engineer.