Resources / Application Notes
Application notes for process engineers
Practical guides on inspection methodology, integration, and deployment. Written for engineers, not marketing audiences.
Process Nodes
Process Node Compatibility Guide: 28nm to 3nm
Optical parameter calibration, training data requirements, and FPR targets at each supported process node. Includes pre-screening steps for node transitions.
Yield Management
False Positive Reduction Methodology
Guide to reducing false positive rates in production: confidence threshold calibration, training data quality, and production-condition testing protocols.
Integration
SECS/GEM Integration Walkthrough: E40 + E87
Step-by-step guide for GEM 300 environments: host configuration, Equipment Constants setup, process job definition, and lot record closure verification.
Inspection Methods
Brightfield vs. Darkfield Mode Selection
Decision guide for scan mode selection based on defect type, substrate material, and process step. Includes throughput tradeoffs.
Compound Semiconductor
Compound Semiconductor Inspection Parameters
Optical calibration for GaN-on-Si, SiC 4H, and SiC 6H substrates. UV fluorescence mode activation, bow detection configuration, and edge scan setup.
Quality Engineering
Human Review Escalation Configuration
Configuring confidence thresholds for human review escalation, per-product-type threshold tuning, review queue MES integration, and escalation rate monitoring.
Deployment
On-Premises Deployment Qualification Protocol
IQ/OQ/PQ documentation template compatible with ISO 9001 and SEMI E10 equipment qualification frameworks.
Hardware Engineering
EMI Hardening in Fab Floor Environments
Installation guidance for high-EMI environments: cable shielding, grounding, and enclosure sealing specifications.
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