Resources / Whitepapers
Technical whitepapers
In-depth papers on inspection economics, reliability methodology, and integration architecture. Gated — available via evaluation request.
Yield Economics
ROI of Automated Wafer Inspection at 7nm and Below
Quantitative model for inspection automation ROI: false positive cost, third-shift yield loss, rework cost, and tool qualification payback period. Includes a worked example at 7nm.
Quality Engineering
Third-Shift Reliability Study: 18 Months of Inspection Data
Internal reliability study covering 18 months of production data. Quantifies third-shift escaped defect rate and compares automated vs. manual inspection consistency.
Integration
SECS/GEM Integration Guide for Automated Vision Inspection Systems
Technical reference for integrating computer vision inspection with fab SECS/GEM infrastructure: protocol selection, MES handshake architecture, and qualification documentation.
Machine Learning
Optical Physics-Based Training Data for Semiconductor Defect Classification
Deep-dive on synthetic training data generation: optical physics simulation, defect morphology modeling, calibration to real inspection data, and FPR validation.
Access whitepapers via evaluation program.
All whitepapers available to engineers in active evaluation programs.